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K4J52324KI-HC08

Mx-Chips Electronics

  • K4J52324KI-HC08

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Part Number K4J52324KI-HC08
Manufacturer SAMSUNG
D/C
Packing BGA
Qty In Stock 195

Product parameter

The K4J52324KI-HC08 parts manufactured by SAMSUNG are available for purchase at Mx Chips Electronics website. Here you can find a wide variety of types and values ​​of electronic parts from the world's leading manufacturers. The K4J52324KI-HC08 components of AnGrand tech Co., Ltd. are carefully chosen, undergo stringent quality control and are successfully meet at all required standards. The production status marked on angrandic.com is for reference only. If you did not find what you were looking for, you can get more value information by email, such as the K4J52324KI-HC08 Inventory quantity, preferential price, and manufacturer. We are always happy to hear from you so feel free to contact us.

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