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K6T0808C1D-DB70

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  • K6T0808C1D-DB70

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Part Number K6T0808C1D-DB70
Manufacturer SAMSUNG
D/C
Packing DIP
Qty In Stock 1839

Product parameter

The K6T0808C1D-DB70 parts manufactured by SAMSUNG are available for purchase at Mx Chips Electronics website. Here you can find a wide variety of types and values ​​of electronic parts from the world's leading manufacturers. The K6T0808C1D-DB70 components of AnGrand tech Co., Ltd. are carefully chosen, undergo stringent quality control and are successfully meet at all required standards. The production status marked on angrandic.com is for reference only. If you did not find what you were looking for, you can get more value information by email, such as the K6T0808C1D-DB70 Inventory quantity, preferential price, and manufacturer. We are always happy to hear from you so feel free to contact us.

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